6 Patents
- US123005842025Semiconductor Device Including Heat Sink with Exposed Side from Encapsulant and a Method of Manufacturing Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US120876762024Semiconductor Devices Having a Plurality of Offsets in Leads Supporting Stacked Components and Methods of Manufacturing Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US120628332024Packaged Electronic Device Having Integrated Antenna and Locking Structure
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US119159982024Semiconductor Device and a Method of Manufacturing a Semiconductor Device
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US116949462023Semiconductor Devices Having a Plurality of Offsets in Leads Supporting Stacked Components and Methods of Manufacturing Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US116771352023Packaged Electronic Device Having Integrated Antenna and Locking Structure
Amkor Technology Singapore Holding Pte. Ltd.
0 cites