Hyung Cheol Kim

3 Patents

• US125986992026

  Ultra-thin Copper Foil with Carrier Foil for Allowing Easy Micro-hole Processing, Copper-clad Laminate Using Same, and Manufacturing Method Therefor

  LOTTE ENERGY MATERIALS CORPORATON

  0 cites
• US119177552024

  Carrier-foil-attached Ultra-thin Copper Foil

  Lotte Energy Materials Corporation

  0 cites
• US116224452023

  Surface-treated Copper Foil, Manufacturing Method Thereof, Copper Foil Laminate Including the Same, and Printed Wiring Board Including the Same

  ILJIN MATERIALS CO., Ltd.

  0 cites