Hyunchul Cho

5 Patents

• US125937052026

  Hybrid Core Substrate with Embedded Components

  QUALCOMM INCORPORATED

  0 cites
• US124164572025

  Heat Exchanger

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US121257422024

  Package Comprising a Substrate with High Density Interconnects

  QUALCOMM INCORPORATED

  0 cites
• US121260712024

  Multi-directional Antenna Modules Employing a Surface-mount Antenna(s) to Support Antenna Pattern Multi-directionality, and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US118698332024

  Package Comprising a Substrate with a via Interconnect Coupled to a Trace Interconnect and Method of Fabricating the Same

  QUALCOMM INCORPORATED

  0 cites