Patents/Inventors

Hyun Jun Hwang

Suwon-siKR2 patents

2 Patents

US125557202026
Multilayer Electronic Component with Enhanced Electrode Connectivity Using Ni and Al Oxide
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US124007912025
Multilayer Electronic Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites