9 Patents
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- US123225232025Conductive Resin Composition, Method of Preparing the Same, and Molded Article Including the Same
LG CHEM, Ltd.
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- US122197052025Flexible Printed Circuit Board, COF Module, and Electronic Device Comprising the Same
LG INNOTEK CO., Ltd.
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- US117456492023Vehicle Panel Including a Perforated Pattern and a Method of Manufacturing Same
KIA CORPORATION
0 cites - US117504042023Decentralized Group Signature Scheme for Credential Systems with Issuer Anonymization
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
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