Patents/Inventors

Hyuekjae Lee

Suwon-siKR18 patents

17 Patents

US125124282025
Semiconductor Device and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US124380642025
Semiconductor Package with Bonding Interface
Samsung Electronics Co., Ltd.
0 cites
US122611642025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122373082025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121320192024
Packaged Multi-chip Semiconductor Devices and Methods of Fabricating Same
Samsung Electronics Co., Ltd.
0 cites
US120403132024
Semiconductor Package and a Method for Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119844212024
Integrated Circuit Chip Having BS-PDN Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119554492024
Stacked Semiconductor Package
SAMSUNG ELECTRONICS CO, Ltd.
0 cites
US119013362024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117989292023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117641922023
Semiconductor Package Including Underfill Material Layer and Method of Forming the Same
Samsung Electronics Co., Ltd.
0 cites
US117216732023
Semiconductor Package Having Stacked Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116949962023
Semiconductor Package Including a Pad Contacting a Via
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116769252023
Semiconductor Packages Having Improved Reliability in Bonds Between Connection Conductors and Pads and Methods of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US116581412023
Die-to-wafer Bonding Structure and Semiconductor Package Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116581482023
Semiconductor Package and a Method for Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115520332023
Packaged Multi-chip Semiconductor Devices and Methods of Fabricating Same
Samsung Electronics Co., Ltd.
0 cites