Patents/Inventors

Hyuek Jae Lee

Hwaseong-siKR2 patents

4 Patents

US118879002024
Semiconductor Package Including Test Pad
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118879682024
Method of Manufacturing a Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117769162023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115812572023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites