Patents/Inventors

Hyoung Il Kim

Folsom, CAUS9 patents

10 Patents

US120465812024
Integrated Circuit Package with Glass Spacer
Intel Corporation
0 cites
US119904492024
Dual RDL Stacked Die Package Using Vertical Wire
Intel Corporation
0 cites
US119489172024
Die Over Mold Stacked Semiconductor Package
Intel Corporation
0 cites
US118308482023
Electronic Device Package
Intel Corporation
0 cites
US118174382023
System in Package with Interconnected Modules
Intel Corporationd
0 cites
US117496532023
Multi-die, Vertical-wire Package-in-package Apparatus, and Methods of Making Same
Intel Corporation
0 cites
US116949872023
Active Package Substrate Having Anisotropic Conductive Layer
Intel Corporation
0 cites
US116580792023
Temporary Interconnect for Use in Testing a Semiconductor Package
Intel Corporation
0 cites
US116370452023
Anisotropic Conductive Film (ACF) for Use in Testing Semiconductor Packages
Intel Corporation
0 cites
US115454642023
Diode for Use in Testing Semiconductor Packages
Intel Corporation
0 cites