Hyoukyung Cho

7 Patents

• US123477812025

  Semiconductor Devices Having Penetration Vias

  Samsung Electronics Co., Ltd.

  0 cites
• US123006712025

  Semiconductor Packages and Methods of Manufacturing the Semiconductor Packages

  Samsung Electronics Co., Ltd.

  0 cites
• US119617882024

  Semiconductor Device Including Through-electrodes

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US118109002023

  Semiconductor Packages Stacked by Wafer Bonding Process and Methods of Manufacturing the Semiconductor Packages

  Samsung Electronics Co., Ltd.

  0 cites
• US118044192023

  Semiconductor Device

  Samsung Electronics Co., Ltd.

  0 cites
• US116949802023

  Semiconductor Stack and Method for Manufacturing the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116643162023

  Semiconductor Devices Having Penetration Vias with Portions Having Decreasing Widths

  Samsung Electronics Co., Ltd.

  0 cites