Hyosan Lee

5 Patents

• US125902472026

  Etching Composition, Method of Etching Metal-containing Film by Using the Same, and Method of Preparing Semiconductor Device by Using the Same

  Samsung Electronics Co., Ltd.

  0 cites
• US123198412025

  Slurry Composition for Chemical Mechanical Polishing

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US122344002025

  Etchant Composition for Etching Silicon Germanium Film and Method of Manufacturing Integrated Circuit Device by Using the Same

  SOULBRAIN, CO., Ltd.

  0 cites
• US117955502023

  Etching Composition, a Method of Etching a Metal Barrier Layer and a Metal Layer Using the Same, and Method of Manufacturing Semiconductor Device Using the Same

  SOULBRAIN CO., Ltd.

  0 cites
• US116107882023

  Process Chamber and Substrate Processing Apparatus Including the Same

  Samsung Electronics Co., Ltd.

  0 cites