10 Patents
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- US124944212025Semiconductor Package Including Redistribution Structure, and Method of Manufacturing the Same
NEPES CO., Ltd.
0 cites - US123866612025Apparatus and Method for Executing Automation Scenario in Parallel
SAMSUNG SDS CO., Ltd.
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- US121280412024Nanoparticles for Delivering Drug, Whose Surface Is Modified with Peptide for Targeting Brain Cancer, Preparation Method Thereof and Use Thereof
UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
0 cites - US121125132024System and Method for Identifying Non-standard User Interface Object
SAMSUNG SDS CO., Ltd.
0 cites - US120173152024Machining Device for Controlling Tool Position Considering Tool Wear and Method for Controlling Tool Position Using the Same
Korea Institute Of Industrial Technology
0 cites - US119318962024Robot System for Controlling Load of Machine Depending on Tool Wear and Method for Controlling Load of Machine Using the Same
Korea Institute Of Industrial Technology
0 cites - US115426062023Method of Tin-plating Copper Alloy for Electric or Electronic Parts and Automobile Parts and Tin-plating Material of Copper Alloy Manufactured Therefrom
Poongsan Corporation
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