Patents/Inventors

Hyo-chang Ryu

Suwon-siKR2 patents

3 Patents

US122782222025
Method of Fabricating Semiconductor Package Including Sub-interposer Substrates
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117216792023
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116705652023
Semiconductor Package with Heat Dissipation Member
SAMSUNG ELECTRONICS CO., Ltd.
0 cites