Patents/Inventors

Hyeonseok Lee

Suwon-siKR6 patents

6 Patents

US126160752026
Semiconductor Package Including a Semiconductor Chip on a Redistribution Substrate and Conductive Structure Spaced Apart from the Semiconductor Chip
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125819482026
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US123947532025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122305562025
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US120574352024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US119488722024
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites