Patents/Inventors

Hyeonjeong Hwang

Suwon-siKR12 patents

13 Patents

US126160752026
Semiconductor Package Including a Semiconductor Chip on a Redistribution Substrate and Conductive Structure Spaced Apart from the Semiconductor Chip
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125819782026
Semiconductor Package Including Under Bump Metallization Pad
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124827212025
Semiconductor Package Including Heat Dissipation Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123880402025
Semiconductor Package Including Redistribution Substrate and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US123811562025
Redistribution Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123622532025
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122611042025
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122611062025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122117772025
Semiconductor Package Including a Dummy Pattern
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121912362025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120402642024
Semiconductor Package Including Under Bump Metallization Pad
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120150182024
Semiconductor Package with Multiple Redistribution Substrates
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119554992024
Image Sensor Package Including Glass Substrate and a Plurality of Redistribution Layers Disposed Below the Glass Substrate and Spaced Apart from Each Other by a Predetermined Distance
SAMSUNG ELECTRONICS CO., Ltd.
0 cites