Patents/Inventors

Hyeongmun Kang

Hwaseong-siKR5 patents

6 Patents

US124631052025
Semiconductor Package Including a Dummy Chip
Samsung Electronics Co., Ltd.
0 cites
US122305752025
Carrier Structure Including Pockets for Accommodating Semiconductor Chip Stack Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121257532024
Semiconductor Package Including Test Bumps
Samsung Electronics Co., Ltd.
0 cites
US117569352023
Chip-stacked Semiconductor Package with Increased Package Reliability
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117216012023
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116581602023
Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites