Patents/Inventors

Hyeong Mook Kim

Suwon-siKR1 patent

2 Patents

US121396422024
CMP Slurry Composition for Polishing Tungsten Pattern Wafer and Method of Polishing Tungsten Pattern Wafer Using the Same
SAMSUNG SDI CO., Ltd.
0 cites
US117462582023
CMP Slurry Composition for Copper Films and Method of Polishing Copper Films Using the Same
SAMSUNG SDI CO., Ltd.
0 cites