27 Patents
- US125000352025Multilayer Electronic Component and Board Having Multilayer Electronic Component Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US122057722025Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US121365232024Multilayer Capacitor and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US119292002024Coil Component and Board Having the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US118759482024Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US117639862023Electronic Component Including Insulating Layer Between Body and Shielding Layer
Samsung Electro-mechanics Co., Ltd.
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- US116315392023Capacitor Component Having Side Margin Portion Including Margin Electrode
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US116107342023Multilayer Ceramic Capacitor and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US115943752023Multilayer Capacitor and Substrate Including the Same Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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