Patents/Inventors

Hwee Seng Chew

SingaporeSG2 patents

3 Patents

US125060552025
Chip Packaging Method and Chip Structure
PEP INNOVATION PTE. Ltd.
0 cites
US121836202024
Apparatus and Method for Bonding a Plurality of Dies to a Carrier Panel
PYXIS CF PTE. Ltd.
0 cites
US119904312024
Semiconductor Structures with via Openings and Methods of Making the Same
PEP INNOVATION PTE. Ltd.
0 cites