3 Patents
- US121293382024Thermosetting Resin Composition for Semiconductor Package, Prepreg and Metal Clad Laminate Using the Same
LG Chem, Ltd.
0 cites - 0 cites
- US115978372023Thermosetting Resin Composition for Semiconductor Package, Prepreg and Metal Clad Laminate Using the Same
LG CHEM, Ltd.
0 cites