Patents/Inventors

Hwanpil Park

Hwaseong-siKR4 patents

5 Patents

US122610932025
Semiconductor Packages Having a Dam Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121365812024
Semiconductor Package Structure and Fabrication Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120339242024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118429412023
Semiconductor Package Structure and Fabrication Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117769132023
Semiconductor Package and a Package-on-package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites