Patents/Inventors

Hwan Pil Park

Hwaseong-siKR4 patents

5 Patents

US122835782025
Semiconductor Package and Method of Fabricating Same
Samsung Electronics Co., Ltd.
0 cites
US119488732024
Semiconductor Package Including a Support Solder Ball
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119088062024
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118760832024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118549892023
Semiconductor Package Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites