Patents/Inventors

Hwail Jin

Seongnam-siKR3 patents

4 Patents

US124698222025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120741422024
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US120402132024
Processing Tape and Method of Fabricating a Semiconductor Device Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118429822023
Semiconductor Package with Curing Layer Between Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites