Hwa Seon Shin

8 Patents

• US124004122025

  Method for Modifying Design on Basis of Additive Cross-section Outline for 3D Printing

  Korea Electronics Technology Institute

  0 cites
• US123508862025

  3D Printing Slicing Method for Solving Quantization Error Problem

  Korea Electronics Technology Institute

  0 cites
• US122336012025

  Method for Creating 2D Slicing Polyline Based Support Structure for 3D Printing

  Korea Electronics Technology Institute

  0 cites
• US122209212025

  Nozzle Clogging Defect Compensating Method for Binder Jetting Stack Manufacturing Means

  Korea Electronics Technology Institute

  0 cites
• US122022062025

  3D Printing Slicing Method for Solving Tolerance Problem

  Korea Electronics Technology Institute

  0 cites
• US117982312023

  Method for Generating Hollow Structure Based on 2D Laminated Cross-sectional Outline for 3D Printing

  Korea Electronics Technology Institute

  0 cites
• US116130822023

  Method for Producing 3D Mesh Surface Characteristic-based Support for Laminate Manufacturing

  Korea Electronics Technology Institute

  0 cites
• US115482272023

  Method for Monitoring 3D Printing Equipped with 3D Printing Slicer and Recursive Loop Structure

  Korea Electronics Technology Institute

  0 cites