Patents/Inventors

Hunteak Lee

Gyeongi-doKR18 patents

19 Patents

US123851282025
Cooling Device and Process for Cooling Double-sided Sip Devices During Sputtering
STATS Chippac Pte. Ltd.
0 cites
US123745592025
Double-sided Partial Molded Sip Module
STATS Chippac Pte. Ltd.
0 cites
US123041222025
Semiconductor Manufacturing Device and Method of Enhancing Mold Gate Injector and Air Vent to Reduce Voids in Encapsulant
STATS Chippac Pte. Ltd.
0 cites
US122666142025
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
STATS Chippac Pte. Ltd.
0 cites
US122118032025
Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
STATS Chippac Pte. Ltd.
0 cites
US122118082025
Semiconductor Device and Method of Forming Discrete Antenna Modules
STATS Chippac Pte. Ltd.
0 cites
US121367592024
Antenna-in-package Devices and Methods of Making
STATS Chippac Pte. Ltd.
0 cites
US120465642024
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
STATS Chippac Pte. Ltd.
0 cites
US119904242024
Selective EMI Shielding Using Preformed Mask
STATS Chippac Pte. Ltd.
0 cites
US119329332024
Cooling Device and Process for Cooling Double-sided Sip Devices During Sputtering
STATS Chippac Pte. Ltd.
0 cites
US119357772024
Semiconductor Manufacturing Equipment and Method of Providing Support Base with Filling Material Disposed Into Openings in Semiconductor Wafer for Support
STATS Chippac Pte Ltd.
0 cites
US118943142024
Semiconductor Device and Method of Forming Semiconductor Package with RF Antenna Interposer Having High Dielectric Encapsulation
STATS Chippac Pte. Ltd.
0 cites
US118878632024
Double-sided Partial Molded SIP Module
STATS Chippac Pte. Ltd.
0 cites
US118429912023
Semiconductor Device and Method of Forming a 3D Interposer System-in-package Module
STATS Chippac Pte. Ltd.
0 cites
US117355392023
Semiconductor Device and Method of Forming Discrete Antenna Modules
STATS Chippac Pte. Ltd.
0 cites
US116769112023
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
STATS Chippac Pte. Ltd.
0 cites
US116643272023
Selective EMI Shielding Using Preformed Mask
STATS Chippac Pte. Ltd.
0 cites
US116520882023
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-package Modules with the Same
STATS Chippac Pte. Ltd.
0 cites
US115878822023
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
STATS Chippac Pte. Ltd.
0 cites