9 Patents
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- US120401972024Mechanical Couplings Designed to Resolve Process Constraints
TEXAS INSTRUMENTS INCORPORATED
0 cites - US119730522024Stud Bump for Wirebonding High Voltage Isolation Barrier Connection
TEXAS INSTRUMENTS INCORPORATED
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- US118482972023Semiconductor Device Packages with High Angle Wire Bonding and Non-gold Bond Wires
Texas Instruments Incorporated
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