27 Patents
- 0 cites
- US125575682026Conductive Feature Formation and Structure
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US125387712026Barrier Layer for an Interconnect Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124944232025Semiconductor Device Including Stacked via Contact and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124314312025Conductive Structure Interconnects with Downward Projections
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124330062025Semiconductor Device with Conductive Liners Over Silicide Structures and Method of Making the Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123946252025Fin Field-effect Transistor Device and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123410132025Method and Structure for Barrier-less Plug
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
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- US123100502025Semiconductor Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122550702025Semiconductor Devices and Methods of Manufacturing
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121996562025Electronic Device, Screen Assembly, and Screen Protection Member and Manufacturing Method Thereof
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites - 0 cites
- US120875752024Conductive Feature Formation and Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
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- US120573972024Capping Layer for Liner-free Conductive Structures
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120515922024Method and Structure for Barrier-less Plug
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120028672024Contact Structure for Semiconductor Device
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US119011832024Fin Field-effect Transistor Device and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US118531202023Foldable Terminal and Screen-on Control Method for Foldable Terminal
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites - US118173842023Interconnect Structure and Manufacturing Method for the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - 0 cites
- 0 cites