23 Patents
- US126096782026Semiconductor Device, Interface Device and Operation Method
Taiwan Semiconductor Manufacturing Company, Ltd.
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- US126010792026High Heat-resistant Antioxidant Solutions for Lithium Battery Copper Foil
NAN YA PLASTICS CORPORATION
0 cites - 0 cites
- US125766232026Pearl Paper Structure and Method for Manufacturing the Same
NAN YA PLASTICS CORPORATION
0 cites - US125060572025Interposer Device and Semiconductor Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US124224812025Semiconductor Chip and Sequence Checking Circuit
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
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- US123657532025Rubber Resin Material with High Thermal Conductivity and High Dielectric Constant and Metal Substrate Using the Same
NAN YA PLASTICS CORPORATION
0 cites - US123565622025Portable Controller with Replaceable Module0 cites
- US122839572025Interface Device and Signal Transceiving Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121178642024Interface Device and Signal Transceiving Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
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- US119031272024Fluoride-based Resin Prepreg and Circuit Substrate Using the Same
NAN YA PLASTICS CORPORATION
0 cites - 0 cites
- US118698462024Interposer Routing Structure and Semiconductor Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118590832024Low-dielectric Rubber Resin Material and Low-dielectric Metal Substrate
NAN YA PLASTICS CORPORATION
0 cites - US116394202023Modified Bismaleimide Resin, Method for Preparing the Same, Prepreg, Copper Clad Laminate and Printed Circuit Board
NAN YA PLASTICS CORPORATION
0 cites