Patents/Inventors

Hung-wen Su

JhubeiTW23 patents

24 Patents

US125819252026
Selective Metal Cap in an Interconnect Structure
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125576292026
Interconnect Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124697452025
Conductive Structures with Bottom-less Barriers and Liners
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123343972025
Interconnect Structure Including Graphite and Method Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123226492025
Interconnect Structure of Semiconductor Device
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123158092025
Via for Semiconductor Device and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122372612025
Semiconductor Device Having a Contact Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121659752024
Method of Forming Interconnect Structure Having a Barrier Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121661282024
Multi-layer Film Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121598372024
Chemical Direct Pattern Plating Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US121598382024
Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120947702024
Ruthenium-based Liner for a Copper Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120805942024
Thermally Stable Copper-alloy Adhesion Layer for Metal Interconnect Structures and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US119963612024
Method of Making a Contact Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119086972024
Interconnect Structure Having a Carbon-containing Barrier Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
0 cites
US118517492023
Semiconductor Device, Method and Machine of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118307422023
Selective Capping Processes and Structures Formed Thereby
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118108572023
Via for Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117770352023
Multi-layer Film Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd
0 cites
US117422902023
Interconnect Structure and Method of Forming Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116826242023
Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116768982023
Diffusion Barrier for Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116520442023
Contact Structure and Method of Making
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115520182023
Chemical Direct Pattern Plating Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites