Hung-wen Hsu

7 Patents

• US125638522026

  Uniform Trenches in Semiconductor Devices and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US125573052026

  Integrated Chip Inductor Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123962722025

  Stilted Pad Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121320752024

  Method (and Related Apparatus) for Forming a Resistor Over a Semiconductor Substrate

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120464772024

  By-site-compensated Etch Back for Local Planarization/topography Adjustment

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119160912024

  BSI Image Sensor and Method of Forming Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117842112023

  Integrated Chip Inductor Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites