Hung-te Lin

5 Patents

• US125504142026

  Wafer-level Die Singulation Using Buried Sacrificial Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US125433332026

  Insulated-gate Bipolar Transistor (IGBT) Device with Improved Thermal Conductivity

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US124577592025

  Semiconductor Arrangement and Method of Manufacture

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

  0 cites
• US121658682024

  Semiconductor Device in a Containment Structure Including a Buried Layer

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US117106322023

  Method of Manufacturing at Least One Semiconductor Device on or in a Base Semiconductor Material Disposed in a Containment Structure Including a Buried Layer

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd

  0 cites