Hung-ping Lee

5 Patents

• US126169982026

  Manufacturing Method of Wafer Level Ultrasonic Device

  SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., Ltd.

  0 cites
• US126116982026

  Wafer Level Ultrasonic Device

  Sonicmems (Zhengzhou) Technology Co., Ltd.

  0 cites
• US118067512023

  Wafer Level Ultrasonic Device and Manufacturing Method Thereof

  SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., Ltd.

  0 cites
• US115905362023

  Wafer Level Ultrasonic Chip Module and Manufacturing Method Thereof

  SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., Ltd.

  0 cites
• US115480312023

  Array-type Ultrasonic Sensor

  SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., Ltd.

  0 cites