10 Patents
- US122550622025Integrate Rinse Module in Hybrid Bonding Platform
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122341412025Outgassing Material Coated Cavity for a Micro-electro Mechanical System Device and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US121856312024Pizoelectric MEMS Device with Electrodes Having Low Surface Roughness
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121393992024Conductive Bond Structure to Increase Membrane Sensitivity in MEMS Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121348242024Undercut-free Patterned Aluminum Nitride Structure and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US119325342024MEMS Device Having a Metallization Structure Embedded in a Dielectric Structure with Laterally Offset Sidewalls of a First Portion and a Second Portion
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118547952023Integrate Rinse Module in Hybrid Bonding Platform
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118275132023Outgassing Material Coated Cavity for a Micro-electro Mechanical System Device and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US118126642023Pizoelectric MEMS Device with Electrodes Having Low Surface Roughness
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116343182023Mems Using Outgassing Material to Adjust the Pressure Level in a Cavity
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites