Patents/Inventors

Hung-hsin Hsu

Hsinchu CountyTW21 patents

17 Patents

US125990142026
Package Device and Manufacturing Method Thereof
POWERTECH TECHNOLOGY Inc.
0 cites
US125688642026
Stacked Package Structure Including a Chip Disposed on a Redistribution Layer and a Molding Layer Comprises a Recess
0 cites
US125638482026
Image Sensor Package
Powertech Technology Inc.
0 cites
US124009792025
Integrated Antenna Package Structure and Manufacturing Method Thereof
Powertech Technology Inc.
0 cites
US121548632024
Fan-out Semiconductor Package and Method for Manufacturing the Same
Powertech Technology Inc.
0 cites
US119904942024
Package Structure and Manufacturing Method Thereof
Powertech Technology Inc.
0 cites
US119730372024
Package Structure and Manufacturing Method Thereof
Powertech Technology Inc.
0 cites
US119117822024
Nozzle Flow Stirring Pipe
ASIA IC MIC-PROCESS, Inc.
0 cites
US119160352024
Package Structure and Manufacturing Method Thereof
Powertech Technology Inc.
0 cites
US117697632023
Package Structure and Manufacturing Method Thereof
Powertech Technology Inc.
0 cites
US116706112023
Semiconductor Package Comprising Plurality of Bumps and Fabricating Method
Powertech Technology Inc.
0 cites
US116370712023
Package Structure Including Multiple Dies Surrounded by Conductive Element and Manufacturing Method Thereof
Powertech Technology Inc.
0 cites
US116179932023
Material Mixing and Supplying System
ASIA IC MIC-PROCESS, Inc.
0 cites
US115692102023
Package Structure Having a First Connection Circuit and Manufacturing Method Thereof
Powertech Technology Inc.
0 cites
US115575332023
Package Structure and Manufacturing Method Thereof
Powertech Technology Inc.
0 cites
US115454232023
Package Structure and Manufacturing Method Thereof
Powertech Technology Inc.
0 cites
US115454242023
Package Structure and Manufacturing Method Thereof
Powertech Technology Inc.
0 cites