Huiming Bu

6 Patents

• US125934682026

  Self-aligned Backside Contact with Increased Contact Area

  International Business Machines Corporation

  0 cites
• US125503592026

  Forming a Sacrificial Liner for Dual Channel Devices

  Adeia Semiconductor Solutions LLC

  0 cites
• US124224652025

  In-situ Chip Design for Pulse IV Self-heating Evaluation

  International Business Machines Corporation

  0 cites
• US122680312025

  Backside Power Rails and Power Distribution Network for Density Scaling

  International Business Machines Corporation

  0 cites
• US121660422024

  Stacked Nanosheet Gate-all-around Device Structures

  International Business Machines Corporation

  0 cites
• US118944622024

  Forming a Sacrificial Liner for Dual Channel Devices

  Adeia Semiconductor Solutions LLC

  0 cites