Patents/Inventors

Huifang Jiao

ShenzhenCN3 patents

3 Patents

US125936892026
Semiconductor Structure with Diamond Heat Dissipation and Manufacturing Method Thereof
Huawei Technologies Co., Ltd.
0 cites
US121834252024
Data Reading/writing Method, Memory, Storage Apparatus, and Terminal
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites
US117569222023
Hybrid Bonding Structure and Hybrid Bonding Method
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites