Patents/Inventors

Huibin Chen

JianCN4 patents

5 Patents

USD10796582025
Data Cable
XIEXUN ELECTRONIC(JIAN) CO., Ltd
0 cites
US123226782025
Encapsulation Structure and Encapsulation Method of Power Module
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites
US121195762024
Press-fit Power Module and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119358172024
Power Device Module with Dummy Pad Die Layout
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US115945102023
Assembly Processes for Semiconductor Device Assemblies Including Spacer with Embedded Semiconductor Die
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites