Hui-yu Huang

8 Patents

• US124646392025

  Semiconductor Package Having Flow-guiding Grooves and Circuit Board Thereof

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US124566732025

  Flip Chip Package and Substrate Thereof

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US124328492025

  Flip-chip Bonding Structure and Circuit Board Thereof

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US120893262024

  Double-sided Flexible Circuit Board

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US119381562024

  Lactic Acid Bacteria and Its Applications

  BENED BIOMEDICAL CO., Ltd.

  0 cites
• US117929232023

  Storage Device for Flexible Circuit Packages and Carrier Thereof

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites
• US117199772023

  Light Reflecting Structure, Backlight Module and Display Device

  Radiant Opto-electronics Corporation

  0 cites
• US116020472023

  Circuit Board Tape and Joining Method Thereof

  CHIPBOND TECHNOLOGY CORPORATION

  0 cites