Hui Sun Park

6 Patents

• US125422392026

  Multilayer Electronic Component and Method for Manufacturing Multilayer Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US121761512024

  Multilayer Capacitor

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US121256412024

  Dielectric Composition and Multilayer Capacitor Comprising the Same

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US120624942024

  Ceramic Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US120515442024

  Ceramic Electronic Component Including Dielectric Layers Having Different Dielectric Compositions

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US117767502023

  Ceramic Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites