Patents/Inventors

Hui-min Huang

TaoyuanTW29 patents

27 Patents

US125507692026
Method for Forming a Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125435522026
Semiconductor Device Structure with Conductive Bumps
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124631662025
Chip Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124191672025
Display Device
Red Oak Innovations Limited
0 cites
US124113842025
Electronic Device
Innolux Corporation
0 cites
US124128582025
Semiconductor Device Structure with Conductive Bumps
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123947362025
Semiconductor Package System and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123811712025
Semiconductor Die Including Stress-resistant Bonding Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US122373202025
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120683032024
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120258922024
Electronic Device with Conductive Lines Having Different Widths
INNOLUX CORPORATION
0 cites
US120274352024
Packages Including Multiple Encapsulated Substrate Blocks and Overlapping Redistribution Structures
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120150022024
Chip Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120093452024
3D Package Structure and Methods of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119904402024
Structure and Formation Method of Semiconductor Device with Conductive Bumps
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119618172024
Apparatus and Method for Forming a Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119570182024
Display Device
INNOLUX CORPORATION
0 cites
US119013192024
Semiconductor Package System and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118879552024
Semiconductor Die Including Stress-resistant Bonding Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US118549642023
Structure and Formation Method of Semiconductor Device with Conductive Bumps
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118550582023
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118429352023
Method for Forming a Reconstructed Package Substrate Comprising Substrates Blocks
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118030852023
Electronic Device
Innolux Corporation
0 cites
US116581872023
Electronic Devices
INNOLUX CORPORATION
0 cites
US116464852023
Liquid-crystal Antenna Device Having First and Second Sealing Members
INNOLUX CORPORATION
0 cites
US115673772023
Electronic Device with Conductive Lines on Different Levels
INNOLUX CORPORATION
0 cites
US115454652023
3D Package Structure and Methods of Forming Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites