Hui Lee

4 Patents

• US122306032025

  Method of Fabricating a Semiconductor Chip Having Strength Adjustment Pattern in Bonding Layer

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121598302024

  Nitrogen Plasma Treatment for Improving Interface Between Etch Stop Layer and Copper Interconnect

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US121425742024

  Semiconductor Devices and Methods of Manufacture

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US117569242023

  Method of Fabricating a Semiconductor Chip Having Strength Adjustment Pattern in Bonding Layer

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites