Hui Kin Lit

3 Patents

• US120806252024

  Semiconductor Package with Releasable Isolation Layer Protection

  Infineon Technologies Austria AG

  0 cites
• US118044242023

  Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip

  Infineon Technologies Austria AG

  0 cites
• US117912382023

  Semiconductor Package with Releasable Isolation Layer Protection

  Infineon Technologies Austria AG

  0 cites