8 Patents
- US125753442026Interconnect Structures and Methods and Apparatuses for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US124008622025Interconnect Structures and Methods and Apparatuses for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123549102025Bi-layer Alloy Liner for Interconnect Metallization and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123477282025Bi-layer Alloy Liner for Interconnect Metallization and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US120947702024Ruthenium-based Liner for a Copper Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120805942024Thermally Stable Copper-alloy Adhesion Layer for Metal Interconnect Structures and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US118548782023Bi-layer Alloy Liner for Interconnect Metallization and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING Ltd.
0 cites - US116948992023Interconnect Structures and Methods and Apparatuses for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites