Huang-hsien Chang

10 Patents

• US122495832025

  Package Structure, Assembly Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US120402612024

  Substrate Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US118943402024

  Package Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US118860152024

  Recessed Portion in a Substrate and Method of Forming the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US118625852024

  Semiconductor Package Structures and Methods of Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US118481432023

  Electronic Device and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US117282822023

  Package Structure, Assembly Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US116317342023

  Vertical Capacitor Structure Having Capacitor in Cavity, and Method for Manufacturing the Vertical Capacitor Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US116212292023

  Wiring Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US115811232023

  Inductor and Circuit Structure and Method of Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites