Huanbo Zhang

5 Patents

• US125519812026

  Machine Learning for Classifying Retaining Rings

  Applied Materials, Inc.

  0 cites
• US123438402025

  Control of Processing Parameters for Substrate Polishing with Substrate Precession

  Applied Materials, Inc.

  0 cites
• US119318532024

  Control of Processing Parameters for Substrate Polishing with Angularly Distributed Zones Using Cost Function

  Applied Materials, Inc.

  0 cites
• US118698152024

  Asymmetry Correction via Oriented Wafer Loading

  Applied Materials, Inc.

  0 cites
• US116732262023

  Retaining Ring for CMP

  Applied Materials, Inc.

  0 cites