3 Patents
- US123278062025Semiconductor Die with Peculiar Bond Pad Arrangement for Leveraging Mutual Inductance Between Bond Wires to Realize Bond Wire T-coil Circuit with Equivalent Negative Inductance
Airoha Technology (HK) Limited
0 cites - US121768952024Apparatus and Method for Generating Dummy Signal That Has Transitions Constrained to Occur Within Transition Enable Windows Set by Detection of More Than Two Consecutive Identical Digits in Serial Data
Airoha Technology (HK) Limited
0 cites - US121135282024Output Driver Using Feedback Network for Slew Rate Reduction and Associated Output Driving Method
Airoha Technology Corp.
0 cites