Patents/Inventors

Hsueh-chung Chen

Cohoes, NYUS26 patents

26 Patents

US125507112026
Interconnection Fabric for Buried Power Distribution
INTERNATIONAL BUSINESS MACHINES COPORATION
0 cites
US125387852026
Fully-aligned and Dielectric Damage-less Top via Interconnect Structure
International Business Machines Corporation
0 cites
US124380842025
Dual-metal Ultra Thick Metal (UTM) Structure
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US124008712025
Metal Lines with Low Via-to-via Spacing
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US124023292025
Top via Containing Random-access Memory Cross-bar Array
International Business Machines Corporation
0 cites
US123746152025
Electronic Devices with a Low Dielectric Constant
International Business Machines Corporation
0 cites
US123694942025
MRAM Top Electrode Structure with Liner Layer
International Business Machines Corporation
0 cites
US122437702025
Hard Mask Removal Without Damaging Top Epitaxial Layer
International Business Machines Corporation
0 cites
US121486172024
Structure and Method to Pattern Pitch Lines
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US121425562024
X-ray Shielding Structure for a Chip
International Business Machines Corporation
0 cites
US121425622024
Subtractive Metal Etch with Improved Isolation for BEOL Interconnect and Cross Point
International Business Machines Corporation
0 cites
US121130132024
Dual Color via Patterning
International Business Machines Corporation
0 cites
US120947742024
Back-end-of-line Single Damascene Top via Spacer Defined by Pillar Mandrels
International Business Machines Corporation
0 cites
US120626092024
Electronic Fuse Structure Embedded in Top Via
International Business Machines Corporation
0 cites
US120109302024
Wrap-around Projection Liner for AI Device
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US119776142024
Circuit Design Watermarking
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US119232462024
Via CD Controllable Top via Structure
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US119087322024
Alternating Spacers for Pitch Structure
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US118173892023
Multi-metal Interconnects for Semiconductor Device Structures
International Business Machines Corporation
0 cites
US117988422023
Line Formation with Cut-first Tip Definition
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US117841202023
Metal via Structure
International Business Machines Corporation
0 cites
US117155942023
Vertically-stacked Interdigitated Metal-insulator-metal Capacitor for Sub-20 Nm Pitch
International Business Machines Corporation
0 cites
US116705802023
Subtractive via Etch for MIMCAP
International Business Machines Corporation
0 cites
US116003252023
Non Volatile Resistive Memory Logic Device
International Business Machines Corporation
0 cites
US116005192023
Skip-via Proximity Interconnect
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US115691342023
Wafer Backside Engineering for Wafer Stress Control
International Business Machines Corporation
0 cites