Hsuan-ning Shih

3 Patents

• US125388352026

  Integrated Chip Package Including a Crack-resistant Lid Structure and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites
• US120948362024

  Semiconductor Device Having Heat Dissipation Structure of Curved Profile and a Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118550302023

  Package Structure and Method of Manufacturing the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites