Hsiu-jen Wang

3 Patents

• US123796762025

  Package Imaging for Die Location Correction in Digital Lithography

  Applied Materials, Inc.

  0 cites
• US123811032025

  Multiple Substrate Handling System and Method

  Applied Materials, Inc.

  0 cites
• US120322842024

  Advanced-packaging High-volume-mode Digital-lithography-tool

  Applied Materials, Inc.

  0 cites