Hsing Kuo Tien

8 Patents

• US125506632026

  Method and Equipment for Manufacturing a Package Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US123158282025

  Package Substrate, Electronic Device Package and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US123006772025

  Semiconductor Device Package Including Stress Buffering Layer

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US120402872024

  Semiconductor Device Package and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US119977982024

  Package Substrate and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US118308342023

  Semiconductor Device, Semiconductor Device Package and Method of Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US117216782023

  Semiconductor Device Package Including Stress Buffering Layer

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US117156942023

  Embedded Component Package Structure Having a Magnetically Permeable Layer

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites