Patents/Inventors

Hsing-chih Liu

HsinchuTW10 patents

11 Patents

US123006792025
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US122305602025
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US121659612024
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US120951422024
Semiconductor Package Having Discrete Antenna Device
MEDIATEK Inc.
0 cites
US119675702024
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die and Heat Spreading Structure
Mediatek Inc.
0 cites
US119087592024
Semiconductor Device
Mediatek Inc.
0 cites
US119087672024
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US117768992023
Via Array Design for Multi-layer Redistribution Circuit Structure
MEDIATEK Inc.
0 cites
US117218822023
Semiconductor Package Having Discrete Antenna Device
Mediatek Inc.
0 cites
US117106882023
Semiconductor Package Structure
MEDIATEK Inc.
0 cites
US117054132023
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die and Heat Spreading Structure
MEDIATEK Inc.
0 cites